
2023-06-20
Small
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ConnectType:
T - Technology & Patents
Industry:
New Materials and Polymer Materials
Country / Region:
China
Company Type:
Listed company
Registered Capital:
100 million RMB
Company Capability: Process Technology Development、Chemical Technology & Patents、Technology Transfer
Yifeng New Materials (Dalian) Co., Ltd. is a high-tech enterprise specializing in the research and development, production, and sales of novel functional materials. Its industry classification falls under specialized chemical product manufacturing (C2669) and electronic specialized material manufacturing (C3985). The company’s core business covers niche areas including electronic-grade epoxy resins and modified composite materials; substrate materials for high-end copper-clad laminates; structural adhesives for lightweight battery packs in new-energy vehicles; and low-dielectric-loss thermal interface materials targeting 5G communication equipment. Leveraging its in-house technical team, the company has filed a total of seven invention patents (three of which have been granted) and five utility model patents. Representative achievements include “high-thermal-conductivity, low-expansion epoxy-boron nitride composite materials” and “high-temperature-resistant, fast-curing structural adhesives for power batteries.” All patents were independently developed and filed by the company, with no co-authorship involving external parties. The company has obtained ISO 9001:2015 Quality Management System certification (Certificate No.: 00122Q3123456R1M) but currently holds no IATF 16949, ISO 14001, or UL/IEC certifications. Regarding application implementation, its EP-850 series of high-thermal-conductivity encapsulation adhesives have entered mass production and supply, being applied to thermal management encapsulation of domestically produced automotive-grade IGBT modules; ABF-replacement thin-film materials for FCBGA substrates have completed pilot-scale trials and sample submission and are currently undergoing customer validation. Its customer base is concentrated among electronics packaging, new-energy vehicle component, and printed circuit board manufacturing enterprises located in Dalian, Shenyang, Changchun, and other cities. Its service coverage focuses on the Northeast China region, and there is no publicly available information indicating overseas business operations or foreign customers. In terms of upstream and downstream industrial chain collaboration, the company offers customized material development, small-batch verification support, and industrialization-oriented cooperative partnerships.
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